Metallography equipment

• Fully compliant to USP <616> methods 1 and methods 2 as well as with EP <2.9.34>, DIN EN ISO 787-11 and ASTM B527
• Determine tapped density and apparent density
• Connect a balance to determine the sample weight (optional, weight can be entered manually)

• Heating elements are located on top, bottom, and sides
• Spacious 14L (0.5 cu. ft.) capacity and reaches a maximum of 1200°C
• Four heating elements

• Accommodates 1", 2" and 3" O.D. process tubes
• Silicon carbide heating elements and Type "R" thermocouple
• Microprocessor-based PID programmable control

• Designed for horizontal or vertical operation
• Patented Moldatherm LGO heating element modules for superior radial and linear temperature uniformity, fast heat-up and cool-down
• Long-life, energy-efficient elements require little or no maintenance

• Innovative use of venting and insulating air spaces to create lower exterior surface temperatures
• Accepts an array of tube adapters (see chart)
• Flexible design, may be used for a variety of applications

• Double-wall construction
• Adjustable high-limit over-temperature protection
• Microprocessor-based PID control

• Feature exclusive LGO heating elements and Moldatherm insulation
• Variable heat-up rate eliminates thermal shock
• An air vent (1 in. dia., top) and air inlet

• Two control options
• RS 485 communications port available as an option
• Controlled heat-up rate eliminates thermal shock to materials

• Release, fast heat-up and recovery
• Heating elements are sidewall mounted to protect integrity of chamber roof
• Type "B" thermocouples assure accurate temperature measurement

• Individual heating elements at chamber top, bottom and sides for uniform heat distribution
• Swing down door provides convenient loading platform.
• Helically coiled, high temperature alloy wire elements for extended service life

• For ash test
• Performing a gravimetric analysis
• Determination of volatile and suspended solids

For a wide range of materials including metals, ceramics, electronics, and other engineered materials.